PRINCIPAL R&D/PRODUCT DVL ENGINEER

Remote from: USA
Annual salary: Undisclosed
Salary information is not provided for this position. Check our Salary Directory to estimate the average compensation for similar roles.
Department: Software Engineering
Employment type: Full Time,
Job posted: 2 Jul 2026
Apply before: 2 Aug 2026
Experience level: Senior
Views / Applies: 113 / 6

Creating a safer, sustainable, productive and connected future

AI Summary

This Principal R&D/Product Development Engineer role at TE Connectivity focuses on designing high-speed, fine-pitch sockets for data center and AI markets. The position involves leading end-to-end product development, from concept to production, with emphasis on signal integrity simulation and customer collaboration. The engineer will mentor teams, drive innovation, and support manufacturing ramp-up. TE Connectivity is a global leader in connectivity solutions, and this role offers an opportunity to work on cutting-edge interconnect technologies.

Role DNA

Job Complexity

Easy Hard

Pace & Pressure

Relaxed Fast-paced

Autonomy Level

Guided Full Ownership

Communication Load

Independent Highly Collaborative

AI Insight The role requires deep expertise in mechanical design, signal integrity simulation, and leadership across cross-functional teams, making it highly challenging but not entry-level.

Salary Analysis

AI Insight The offered salary is not specified, but for a Principal R&D Engineer in this field, the market range is $120k-$220k, with a median around $170k. This role typically commands a premium due to its seniority and technical demands.

Core Skills Required

Product Development Signal Integrity Ansys HFSS Socket Design High-Speed Interconnects Mechanical Design DFMEA Customer Engagement Leadership Mentoring

Cover Letter Sample

I am writing to express my interest in the Principal R&D/Product Development Engineer position at TE Connectivity. With over a decade of experience in designing advanced interconnect solutions, I specialize in high-speed socket development, signal integrity simulation, and leading cross-functional teams. My background includes mentoring engineers and collaborating directly with customers to translate their needs into innovative products. I am excited about the opportunity to contribute to TE's leadership in connectivity for AI and data centers.

Sample Interview Questions

Can you describe a time you led a complex socket design from concept to production?

I led the development of a 0.4mm pitch, 15k pin socket for a next-generation server. I managed the design using Creo, performed SI simulations in Ansys HFSS, and collaborated with manufacturing to resolve warpage issues. The project launched on schedule, meeting all electrical and mechanical requirements.

How do you approach signal integrity challenges in high-speed socket designs?

I start with understanding the channel requirements and use 3D electromagnetic simulations to model the socket's impedance and crosstalk. I optimize contact geometry and material selection, then validate with time-domain reflectometry. Collaboration with the SI team ensures the design meets the target bit error rate.

Describe your experience mentoring junior engineers in mechanical design or SI simulation.

I established a training program for new engineers covering Creo best practices and HFSS simulation techniques. I hold weekly design reviews and hands-on workshops. One mentee successfully redesigned a connector, reducing insertion loss by 15%.

How do you balance customer-specific requirements with manufacturing constraints?

I involve manufacturing early in the concept phase through DFM reviews and DFMEA. I present trade-offs to customers, such as cost vs. performance, and align on specifications that are feasible. This approach minimizes rework and ensures a smooth ramp-up.

What strategies do you use to drive innovation in socket product development?

I stay current with industry trends in high-speed interconnects and participate in pathfinding workshops with customers. I encourage the team to propose new contact designs or materials, and we prototype and test quickly. This proactive approach has led to patented solutions for 224Gbps applications.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

COMPANY

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enables the distribution of power, signal, and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology, and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram.

BU / FUNCTION DESCRIPTION

Key markets of Digital Data Networks are Artificial Intelligence (AI), Cloud, Enterprise/Telecommunications, Tier 3/Business Retail Equipment (BRE), and Internet of Things (IoT). In these markets, we are driving growth and innovation with an industry-leading product portfolio and global manufacturing capabilities.
TE /448GB/shas specialized in socket products since 1970 and has developed a large size socket (>10K pin count), small pitch socket (<0.4mm pitch) for high-speed applications (224/448Gbps)

ROLE OBJECTIVE

As Principal R&D Product Development Engineer of the DDN socket team, you will focus on creating relationships with customer innovators and influencers, defining and driving technical activities, coordinating and facilitating technical engineering-related communications for internal/external customers, creating the product standard for a key technology, and contributing to the technical roadmap of the socket products.

Job Requirements

1. Concept Development & Design
• Develop innovative design concepts and conduct feasibility studies to assess technical and commercial viability.
• Collaborate with global Product Design Engineering (PDE) teams to accurately convert VOC and PRD into detailed design inputs for precise socket development.
• Create simplified 3D models and perform signal integrity (SI) simulations using advanced tools such as Ansys HFSS to validate electrical signal performance.
• Build and test prototype samples, execute design validation plans, and complete product qualification to finalize specifications.

2. Strategic & Leadership Responsibilities
• Lead end-to-end product development of high-speed, fine-pitch, large-size sockets—from market definition, concept creation to design, review, and production release.
• Foster strong alignment between business and customer engineering teams to deepen market understanding and drive customer-centric innovation.
• Responsible for mentoring and training engineering teams in advanced mechanical design principles and signal integrity simulation methodologies, including hands-on guidance in using industry-standard tools such as Creo and Ansys HFSS, to ensure design robustness, performance optimization, and alignment with high-speed interconnect requirements.

3. Customer & Market Engagement
• Collaborate closely with customers and internal stakeholders (Sales, System Architects, FAEs, and PMs) to capture clear Voice of Customer (VOC) and translate it into conceptual designs and preliminary product specifications.
• Engage in early-stage pathfinding with customers to co-develop cutting-edge interconnect solutions that meet future technological needs.
• Prepare and present engineering evaluations and proposals to customers, aligning solutions with application requirements and performance targets

4. Manufacturing Support & Quality Assurance
• Provide technical support to manufacturing and quality teams to ensure efficient ramp-up, process optimization, and safe product launches.
• Support cross-functional teams—including customers, Sales, PMs, and manufacturing sites—through DFMEA, testing, troubleshooting, and engineering analysis.

What your background should look like

• Bachelor’s degree in Mechanical or Mechatronics Engineering; Master’s degree preferred.
• Minimum of 5 years of work experience in mechanical design for high-speed interconnect products, with high-speed signal integrity knowledge preferred.
• Direct customer design and support experience, including the ability to work with Field Application Engineers to troubleshoot customer problems and improve existing designs.
• Design experience with high-speed servers, switches, and memory is a plus.
• Understanding semiconductor IC packaging and fundamental test/burn-in methodology.
• Expert-level knowledge of interconnect design or experience with high-speed connectors with PCIE Gen 6/7 compliance.
• High level of competency in mechanical design tools such as Creo/SolidWorks.
• Good level of competency in signal integrity analysis tools (Ansys HFSS, Keysight ADS).
• Strong analytical capabilities to interpret simulation and lab data, identify issues, and provide solutions.
• Six Sigma methodologies or other strong data analytics background is a plus.
• Excellent verbal and written communication skills.
• Ability to work in a global environment, fluent in English (verbal/written), and able to collaborate across geographies.
• Highly motivated, quick learner, and able to work independently.